- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
Patent holdings for IPC class H01L 21/8252
Total number of patents in this class: 489
10-year publication summary
43
|
51
|
53
|
61
|
59
|
63
|
37
|
31
|
36
|
13
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Intel Corporation | 45621 |
50 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
45 |
International Business Machines Corporation | 60644 |
22 |
Skyworks Solutions, Inc. | 3450 |
17 |
Murata Manufacturing Co., Ltd. | 22355 |
14 |
Texas Instruments Incorporated | 19376 |
13 |
Innoscience (Suzhou) Technology Co., ltd. | 165 |
13 |
QROMIS, Inc. | 87 |
11 |
Samsung Electronics Co., Ltd. | 131630 |
9 |
Semiconductor Components Industries, L.L.C. | 5345 |
9 |
Qorvo US, Inc. | 2018 |
9 |
Qualcomm Incorporated | 76576 |
8 |
Raytheon Company | 8535 |
8 |
MACOM Technology Solutions Holdings, Inc. | 784 |
8 |
Cambridge GaN Devices Limited | 30 |
8 |
Mitsubishi Electric Corporation | 43934 |
7 |
Efficient Power Conversion Corporation | 120 |
7 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
7 |
Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
6 |
Infineon Technologies Austria AG | 1954 |
5 |
Other owners | 213 |