• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology

Patent holdings for IPC class H01L 21/8252

Total number of patents in this class: 489

10-year publication summary

43
51
53
61
59
63
37
31
36
13
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Intel Corporation
45621
50
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
45
International Business Machines Corporation
60644
22
Skyworks Solutions, Inc.
3450
17
Murata Manufacturing Co., Ltd.
22355
14
Texas Instruments Incorporated
19376
13
Innoscience (Suzhou) Technology Co., ltd.
165
13
QROMIS, Inc.
87
11
Samsung Electronics Co., Ltd.
131630
9
Semiconductor Components Industries, L.L.C.
5345
9
Qorvo US, Inc.
2018
9
Qualcomm Incorporated
76576
8
Raytheon Company
8535
8
MACOM Technology Solutions Holdings, Inc.
784
8
Cambridge GaN Devices Limited
30
8
Mitsubishi Electric Corporation
43934
7
Efficient Power Conversion Corporation
120
7
GLOBALFOUNDRIES U.S. Inc.
6459
7
Commissariat à l'énergie atomique et aux energies alternatives
10525
6
Infineon Technologies Austria AG
1954
5
Other owners 213